ISO 9455-14:2017
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ISO 9455-14:2017
69292

Status : Published (Under review)

This standard was last reviewed and confirmed in 2023. Therefore this version remains current.
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Format Language
std 1 42 PDF + ePub
std 2 42 Paper
  • CHF42
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Abstract

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

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General information

  •  : Published
     : 2017-08
    : International Standard confirmed [90.93]
  •  : 2
     : 4
  • ISO/TC 44/SC 12
    25.160.50 
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